There are no models available for this part yet.
Overview of HY57V561620CTP-8 by SK Hynix Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Financial Technology (Fintech)
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Electronic Manufacturing
Entertainment and Gaming
Automotive
CAD Models for HY57V561620CTP-8 by SK Hynix Inc
Part Data Attributes for HY57V561620CTP-8 by SK Hynix Inc
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SK HYNIX INC
|
|
Part Package Code
|
TSOP2
|
|
Package Description
|
TSOP2, TSOP54,.46,32
|
|
Pin Count
|
54
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.24
|
|
Access Mode
|
FOUR BANK PAGE BURST
|
|
Access Time-Max
|
6 ns
|
|
Additional Feature
|
AUTO/SELF REFRESH
|
|
Clock Frequency-Max (fCLK)
|
125 MHz
|
|
I/O Type
|
COMMON
|
|
Interleaved Burst Length
|
1,2,4,8
|
|
JESD-30 Code
|
R-PDSO-G54
|
|
JESD-609 Code
|
e6
|
|
Length
|
22.238 mm
|
|
Memory Density
|
268435456 bit
|
|
Memory IC Type
|
SYNCHRONOUS DRAM
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Ports
|
1
|
|
Number of Terminals
|
54
|
|
Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
16MX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSOP2
|
|
Package Equivalence Code
|
TSOP54,.46,32
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE
|
|
Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
8192
|
|
Seated Height-Max
|
1.194 mm
|
|
Self Refresh
|
YES
|
|
Sequential Burst Length
|
1,2,4,8,FP
|
|
Standby Current-Max
|
0.001 A
|
|
Supply Current-Max
|
0.2 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN BISMUTH
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
10.16 mm
|
Alternate Parts for HY57V561620CTP-8
This table gives cross-reference parts and alternative options found for HY57V561620CTP-8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY57V561620CTP-8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT48LC16M16A1TG-8E | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP-54 | Micron Technology Inc | HY57V561620CTP-8 vs MT48LC16M16A1TG-8E |
| K4S561632C-TP1L | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 | Samsung Semiconductor | HY57V561620CTP-8 vs K4S561632C-TP1L |
| UPD45256163G5-A10-9JF | Synchronous DRAM, 16MX16, 6ns, MOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 | NEC Electronics Group | HY57V561620CTP-8 vs UPD45256163G5-A10-9JF |
| HYB39S256160DTL-8 | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 | Infineon Technologies AG | HY57V561620CTP-8 vs HYB39S256160DTL-8 |
| V54C3256164VBUT8PC | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 | Mosel Vitelic Corporation | HY57V561620CTP-8 vs V54C3256164VBUT8PC |
| V54C3256164VAT-8PC | 16MX16 SYNCHRONOUS DRAM, 6ns, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 | Mosel Vitelic Corporation | HY57V561620CTP-8 vs V54C3256164VAT-8PC |
| HY57V561620BT-8I | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 | SK Hynix Inc | HY57V561620CTP-8 vs HY57V561620BT-8I |
| KM416S16230AT-G/FH | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 | Samsung Semiconductor | HY57V561620CTP-8 vs KM416S16230AT-G/FH |
| HY57V561620T-SI | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 | SK Hynix Inc | HY57V561620CTP-8 vs HY57V561620T-SI |
| HYB39S256160DEL-8 | Synchronous DRAM, 16MX16, 6ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 | Infineon Technologies AG | HY57V561620CTP-8 vs HYB39S256160DEL-8 |