Part Details for HTSH5601ETK by NXP Semiconductors
Overview of HTSH5601ETK by NXP Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HTSH5601ETK
HTSH5601ETK CAD Models
HTSH5601ETK Part Data Attributes
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HTSH5601ETK
NXP Semiconductors
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HTSH5601ETK
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PDSO2, 3 X 2 MM, 0.85 MM HEIGHT, PLASTIC, SOT899-1, HVSON-2
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 3 X 2 MM, 0.85 MM HEIGHT, PLASTIC, SOT899-1, HVSON-2 | |
Pin Count | 2 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.32.00 | |
JESD-30 Code | R-PDSO-N2 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | OTHER | |
Terminal Form | NO LEAD | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |