There are no models available for this part yet.
Overview of HT9312AI by Holtek Semiconductor Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
CAD Models for HT9312AI by Holtek Semiconductor Inc
Part Data Attributes for HT9312AI by Holtek Semiconductor Inc
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|---|---|
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Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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HOLTEK SEMICONDUCTOR INC
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Package Description
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DIP, DIP18(UNSPEC)
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Reach Compliance Code
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unknown
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HTS Code
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8542.39.00.01
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Crystal Frequency
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3.58 MHz
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JESD-30 Code
|
R-PDIP-T18
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JESD-609 Code
|
e0
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Number of Terminals
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18
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|
Operating Temperature-Max
|
70 °C
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|
Operating Temperature-Min
|
-20 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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DIP
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Package Equivalence Code
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DIP18(UNSPEC)
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Qualification Status
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Not Qualified
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Supply Current-Max
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2 mA
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|
Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
|
Tin/Lead (Sn/Pb)
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|
Terminal Form
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THROUGH-HOLE
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Terminal Position
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DUAL
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