Part Details for HN58X2564TIE by Renesas Electronics Corporation
Overview of HN58X2564TIE by Renesas Electronics Corporation
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Part Details for HN58X2564TIE
HN58X2564TIE CAD Models
HN58X2564TIE Part Data Attributes:
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HN58X2564TIE
Renesas Electronics Corporation
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HN58X2564TIE
Renesas Electronics Corporation
EEPROM, TSSOP(8), /
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TSSOP(8) | |
| Package Description | TSSOP, | |
| Pin Count | 8 | |
| Manufacturer Package Code | PTSP0008JC-B | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Clock Frequency-Max (fCLK) | 3 MHz | |
| JESD-30 Code | R-PDSO-G8 | |
| Length | 4.4 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Serial Bus Type | SPI | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm | |
| Write Cycle Time-Max (tWC) | 8 ms |