Part Details for HN58X25256FPIAG by Renesas Electronics Corporation
Overview of HN58X25256FPIAG by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HN58X25256FPIAG#S0 | Renesas Electronics Corporation | Serial Peripheral Interface 128k EEPROM (16-kword × 8-bit) 256k EEPROM (32-kword × 8-bit) |
Part Details for HN58X25256FPIAG
HN58X25256FPIAG CAD Models
HN58X25256FPIAG Part Data Attributes
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HN58X25256FPIAG
Renesas Electronics Corporation
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HN58X25256FPIAG
Renesas Electronics Corporation
32KX8 SPI BUS SERIAL EEPROM, PDSO8, 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | SOIC | |
| Package Description | 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 3 MHz | |
| Data Retention Time-Min | 10 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G8 | |
| Length | 4.89 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.73 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.000003 A | |
| Supply Current-Max | 0.004 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 3.9 mm | |
| Write Cycle Time-Max (tWC) | 8 ms | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for HN58X25256FPIAG
This table gives cross-reference parts and alternative options found for HN58X25256FPIAG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN58X25256FPIAG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M95256MN3P | 32X8 SPI BUS SERIAL EEPROM, 60ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256MN3P |
| M95256RMN6G | 32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256RMN6G |
| M95256WMN6G | 32X8 SPI BUS SERIAL EEPROM, 40ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256WMN6G |
| M95256RMN6TG | 32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256RMN6TG |
| M95256WDW6G | 32X8 SPI BUS SERIAL EEPROM, 40ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256WDW6G |
| M95256-DWDW3P | 32X8 SPI BUS SERIAL EEPROM, 60ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256-DWDW3P |
| M95256DW3TG | 32X8 SPI BUS SERIAL EEPROM, 60ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256DW3TG |
| M95256RDW6TG | 32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256RDW6TG |
| M95256-DDW3P | 32X8 SPI BUS SERIAL EEPROM, 60ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256-DDW3P |
| M95256WDW3P | 32X8 SPI BUS SERIAL EEPROM, 60ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | HN58X25256FPIAG vs M95256WDW3P |