Part Details for HN58X2432TIE by Renesas Electronics Corporation
Overview of HN58X2432TIE by Renesas Electronics Corporation
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Part Details for HN58X2432TIE
HN58X2432TIE CAD Models
HN58X2432TIE Part Data Attributes
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HN58X2432TIE
Renesas Electronics Corporation
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Datasheet
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HN58X2432TIE
Renesas Electronics Corporation
4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, TSSOP-8
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | SOIC | |
Package Description | LEAD FREE, PLASTIC, TSSOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 0.4 MHz | |
Data Retention Time-Min | 10 | |
Endurance | 100000 Write/Erase Cycles | |
I2C Control Byte | 1010DDDR | |
JESD-30 Code | R-PDSO-G8 | |
Length | 4.4 mm | |
Memory Density | 32768 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Serial Bus Type | I2C | |
Standby Current-Max | 0.000003 A | |
Supply Current-Max | 0.003 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.8 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Width | 3 mm | |
Write Cycle Time-Max (tWC) | 15 ms | |
Write Protection | HARDWARE |