Memory
HN58V1001P-25
Description: EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Overview of HN58V1001P-25 by Hitachi Ltd

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for HN58V1001P-25 by Hitachi Ltd

Part # Manufacturer Description Stock Price Buy
Bristol Electronics   Min Qty: 1 15
  • 1 $21.0600
$21.0600 Buy Now
Quest Components   12
  • 1 $22.8150
$22.8150 Buy Now

CAD Models for HN58V1001P-25 by Hitachi Ltd
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Part Data Attributes for HN58V1001P-25 by Hitachi Ltd

HN58V1001P-25
Hitachi Ltd
-
-
Part Life Cycle Code
Transferred
Ihs Manufacturer
HITACHI LTD
Part Package Code
DIP
Package Description
DIP, DIP32,.6
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
250 ns
Additional Feature
10000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 128 BYTE PAGE WRITE
Command User Interface
NO
Data Polling
YES
Data Retention Time-Min
10
JESD-30 Code
R-PDIP-T32
Length
41.9 mm
Memory Density
1048576 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX8
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Page Size
128 words
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
5.08 mm
Standby Current-Max
0.00002 A
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Toggle Bit
YES
Width
15.24 mm
Write Cycle Time-Max (tWC)
15 ms
Want to compare parts?
  1. HN58V1001P-25
    Hitachi Ltd
    EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
    VS

Alternate Parts for HN58V1001P-25

This table gives cross-reference parts and alternative options found for HN58V1001P-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN58V1001P-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
28LV010RT1DI-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Data Device Corporation HN58V1001P-25 vs 28LV010RT1DI-25
28LV010RT4DE-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RT4DE-25
28LV010RPDE-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RPDE-25
28LV010RT1DS-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RT1DS-25
AT28LV010-25PI EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN58V1001P-25 vs AT28LV010-25PI
AT28LV010-25PJ EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32 Microchip Technology Inc HN58V1001P-25 vs AT28LV010-25PJ
28LV010RT2DE-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RT2DE-25
28LV010RPDB-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RPDB-25
28LV010RPDE-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Data Device Corporation HN58V1001P-25 vs 28LV010RPDE-25
28LV010RPDS-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28LV010RPDS-25
Part Number Description Manufacturer Compare
CAT28F010PI-15 Flash, 128KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Catalyst Semiconductor HN58V1001P-25 vs CAT28F010PI-15
CAT28F001LA-12B Flash, 128KX8, 120ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN58V1001P-25 vs CAT28F001LA-12B
HN62331AP MASK ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd HN58V1001P-25 vs HN62331AP
HN27C301P-25 OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HN58V1001P-25 vs HN27C301P-25
28C010TRT4DS-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN58V1001P-25 vs 28C010TRT4DS-12
WME128K8-250CM EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN58V1001P-25 vs WME128K8-250CM
SST27VF010-90-3C-PHE Flash, 128KX8, 90ns, PDIP32, PLASTIC, MO-015AP, DIP-32 Silicon Storage Technology HN58V1001P-25 vs SST27VF010-90-3C-PHE
CAT28F010LI-12 Flash, 128KX8, 120ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN58V1001P-25 vs CAT28F010LI-12
CAT28F010P-12 Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN58V1001P-25 vs CAT28F010P-12
HN27C101AG-20 UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd HN58V1001P-25 vs HN27C101AG-20

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