Part Details for HN27C256AG-10 by Hitachi Ltd
Overview of HN27C256AG-10 by Hitachi Ltd
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for HN27C256AG-10
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 63 |
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RFQ | |
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Chip 1 Exchange | INSTOCK | 63 |
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RFQ |
Part Details for HN27C256AG-10
HN27C256AG-10 CAD Models
HN27C256AG-10 Part Data Attributes
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HN27C256AG-10
Hitachi Ltd
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Datasheet
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HN27C256AG-10
Hitachi Ltd
UVPROM, 32KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 100 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 36.83 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.89 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HN27C256AG-10
This table gives cross-reference parts and alternative options found for HN27C256AG-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C256AG-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M5M27C256AK-10 | UVPROM, 32KX8, 100ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Mitsubishi Electric | HN27C256AG-10 vs M5M27C256AK-10 |
| TMS27C256-10JL | 262 144-Bitprogrammable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | HN27C256AG-10 vs TMS27C256-10JL |
| M27C256B-10F1 | 32KX8 UVPROM, 100ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | HN27C256AG-10 vs M27C256B-10F1 |
| NM27C256Q100 | UVPROM, 32KX8, 100ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Fairchild Semiconductor Corporation | HN27C256AG-10 vs NM27C256Q100 |
| AM27C256-100DC | UVPROM, 32KX8, 100ns, CMOS, CDIP32, CERAMIC, DIP-32 | AMD | HN27C256AG-10 vs AM27C256-100DC |