Part Details for HN27C256AFP-12T by Hitachi Ltd
Overview of HN27C256AFP-12T by Hitachi Ltd
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for HN27C256AFP-12T
HN27C256AFP-12T CAD Models
HN27C256AFP-12T Part Data Attributes:
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HN27C256AFP-12T
Hitachi Ltd
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Datasheet
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HN27C256AFP-12T
Hitachi Ltd
OTP ROM, 32KX8, 120ns, CMOS, PDSO28, PLASTIC, SOP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP28,.5 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 120 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G28 | |
| JESD-609 Code | e0 | |
| Length | 18 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP28,.5 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3 mm | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 8.4 mm |