Part Details for HMP8201CN by Intersil Corporation
Results Overview of HMP8201CN by Intersil Corporation
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
HMP8201CN Information
HMP8201CN by Intersil Corporation is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for HMP8201CN
HMP8201CN CAD Models
HMP8201CN Part Data Attributes
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HMP8201CN
Intersil Corporation
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Datasheet
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HMP8201CN
Intersil Corporation
IC,COMPRESSION/EXPANSION CIRCUIT,CMOS,QFP,208PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTERSIL CORP | |
| Package Description | QFP, QFP208,1.2SQ,20 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PQFP-G208 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD |