Part Details for HMC992LP5E by Analog Devices Inc
Results Overview of HMC992LP5E by Analog Devices Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
HMC992LP5E Information
HMC992LP5E by Analog Devices Inc is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part Details for HMC992LP5E
HMC992LP5E CAD Models
HMC992LP5E Part Data Attributes
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HMC992LP5E
Analog Devices Inc
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Datasheet
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HMC992LP5E
Analog Devices Inc
IF Automatic Gain Controller (IF-AGC), 0.05 - 0.8 GHz
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | QFN-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | HCP-32-1 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | S-PQCC-N32 | |
| JESD-609 Code | e3 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 5 mm |
HMC992LP5E Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
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Use a network analyzer to measure the input and output impedance of the device. Then, use a Smith chart to design and optimize the matching networks for maximum gain and efficiency.
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Follow the recommended biasing and tuning procedures outlined in the datasheet. Use a variable voltage source to adjust the bias voltage, and a signal generator to tune the device for optimal performance.
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Monitor the device's voltage, current, and temperature to ensure they are within the recommended operating ranges. Use a thermal monitor and a voltage limiter to prevent damage.
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Handle the device with an ESD wrist strap or mat. Use an ESD-protected workstation and follow proper handling procedures to prevent damage.