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HMC524ALC3B
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HMC524ALC3B by Analog Devices Inc is an RF/Microwave Mixer.
RF/Microwave Mixers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
505-HMC524ALC3B-ND
|
DigiKey | IC MMIC IQ MIXER 12SMD Min Qty: 1 Lead time: 13 Weeks Container: Strip |
21 In Stock |
|
$42.1978 / $54.4200 | Buy Now |
DISTI #
584-HMC524ALC3B
|
Mouser Electronics | RF Mixer GaAs MMIC I/Q Mixer / IRM Chip, 22 - 32 RoHS: Compliant | 0 |
|
$41.5000 / $54.3200 | Order Now |
DISTI #
35300101
|
Verical | Up/Down Conv Mixer 32GHz 12-Pin CLLCC EP T/R RoHS: Compliant Min Qty: 17 Package Multiple: 17 | Americas - 646 |
|
$41.3143 | Buy Now |
DISTI #
HMC524ALC3B
|
Richardson RFPD | RF MIXER RoHS: Compliant Min Qty: 17 | 0 |
|
$37.8200 / $42.1400 | Buy Now |
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HMC524ALC3B
Analog Devices Inc
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Datasheet
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HMC524ALC3B
Analog Devices Inc
HMC524ALC3B
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Package Description | LCC-12 | |
Pin Count | 12 | |
Manufacturer Package Code | E-12-4 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Analog Devices | |
Characteristic Impedance | 50 Ω | |
Construction | COMPONENT | |
Conversion Loss-Max | 13 dB | |
Input Power-Max (CW) | 20 dBm | |
Mounting Feature | SURFACE MOUNT | |
Number of Terminals | 12 | |
Operating Frequency-Max | 32000 MHz | |
Operating Frequency-Min | 22000 MHz | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC | |
Package Equivalence Code | LCC12,.12SQ,20 | |
RF/Microwave Device Type | IMAGE REJECTION | |
Surface Mount | YES | |
Technology | GAAS | |
Terminal Finish | Tungsten/Nickel/Gold (W/Ni/Au) |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a heat sink and thermal interface material. Refer to the application note AN-954 for more details.
Optimize the output power and efficiency by adjusting the input power, bias voltage, and load impedance. Use the device's built-in power detector and adjust the bias voltage to achieve the desired output power. Refer to the application note AN-1349 for more details.
Use a pi-network or a T-network for input and output matching. The recommended values for the matching components can be found in the application note AN-1349. Simulation tools like ADS or AWR can also be used to optimize the matching networks.
Use ESD protection devices such as TVS diodes or ESD arrays at the input and output ports. Ensure that the PCB design includes ESD protection and follow proper handling and storage procedures to prevent ESD damage.
The maximum junction temperature is 150°C. Derate the output power by 1 dB for every 10°C increase in junction temperature above 85°C. Refer to the datasheet for more details on thermal limitations and derating factors.