Part Details for HMC422MS8E by Analog Devices Inc
Results Overview of HMC422MS8E by Analog Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
HMC422MS8E Information
HMC422MS8E by Analog Devices Inc is a Cellular Telephone Circuit.
Cellular Telephone Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for HMC422MS8E
HMC422MS8E CAD Models
HMC422MS8E Part Data Attributes
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HMC422MS8E
Analog Devices Inc
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Datasheet
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HMC422MS8E
Analog Devices Inc
DBL-BAL Mixer with LO Amplifier SMT, 1.2 - 2.6 GHz
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | SMT-8 | |
| Pin Count | 8 | |
| Manufacturer Package Code | HRM-8-1 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 3 mm |
Alternate Parts for HMC422MS8E
This table gives cross-reference parts and alternative options found for HMC422MS8E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HMC422MS8E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HMC422MS8 | Hittite Microwave Corp | Check for Price | RF and Baseband Circuit, PDSO8, PLASTIC, SMT-8 | HMC422MS8E vs HMC422MS8 |
HMC422MS8E Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure good thermal conductivity and minimal thermal resistance to maintain junction temperature below 125°C.
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Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a pi-network or a T-network topology, and adjust component values to achieve optimal impedance matching.
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Follow the recommended biasing and tuning procedures outlined in the datasheet. Adjust the bias voltage and current to achieve optimal performance, and use a iterative tuning process to optimize the device's performance.
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Use a thermally stable package and a stable voltage regulator to minimize thermal drift. Implement a frequency compensation network to minimize frequency drift. Consider using a temperature compensation circuit to stabilize the device's performance.
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Follow standard ESD protection procedures, including the use of ESD-safe workstations, wrist straps, and packaging materials. Handle the device by the package, avoiding direct contact with the pins or die.