Datasheets
HMC284MS8G by:
Hittite Microwave Corp
Analog Devices Inc
Hittite Microwave Corp
Not Found

SPDT, 0MHz Min, 3500MHz Max, 1 Func, 1.1dB Insertion Loss-Max, ULTRA SMALL, PLASTIC, SMT, MSOP-8

Part Details for HMC284MS8G by Hittite Microwave Corp

Results Overview of HMC284MS8G by Hittite Microwave Corp

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Applications Consumer Electronics

HMC284MS8G Information

HMC284MS8G by Hittite Microwave Corp is an RF/Microwave Switch.
RF/Microwave Switches are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for HMC284MS8G

Part # Distributor Description Stock Price Buy
Bristol Electronics   320
RFQ
Quest Components 0 MHZ - 3500 MHZ RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.1 DB INSERTION LOSS 8
  • 1 $5.2350
  • 3 $4.3625
  • 7 $3.8390
$3.8390 / $5.2350 Buy Now
NexGen Digital   200
RFQ

Part Details for HMC284MS8G

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HMC284MS8G Part Data Attributes

HMC284MS8G Hittite Microwave Corp
Buy Now Datasheet
Compare Parts:
HMC284MS8G Hittite Microwave Corp SPDT, 0MHz Min, 3500MHz Max, 1 Func, 1.1dB Insertion Loss-Max, ULTRA SMALL, PLASTIC, SMT, MSOP-8
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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer HITTITE MICROWAVE CORP
Package Description ULTRA SMALL, PLASTIC, SMT, MSOP-8
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8536.50.70.00
1dB Compression Point 24 dBm
Additional Feature CMOS/TTL COMPATIBLE
Characteristic Impedance 50 Ω
Construction COMPONENT
Input Power-Max (CW) 26.02 dBm
Insertion Loss-Max 1.1 dB
Isolation-Min 30 dB
JESD-609 Code e0
Mounting Feature SURFACE MOUNT
Number of Functions 1
Number of Terminals 8
Operating Frequency-Max 3500 MHz
Operating Frequency-Min
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP8,.19
Power Supplies 5 V
RF/Microwave Device Type SPDT
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
VSWR-Max 1.12

Alternate Parts for HMC284MS8G

This table gives cross-reference parts and alternative options found for HMC284MS8G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HMC284MS8G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
HMC284MS8GE Hittite Microwave Corp Check for Price SPDT, 0MHz Min, 3500MHz Max, 1 Func, 1.1dB Insertion Loss-Max, ROHS COMPLIANT, ULTRA SMALL, PLASTIC, SMT, MSOP-8 HMC284MS8G vs HMC284MS8GE
HMC284MS8GETR Hittite Microwave Corp Check for Price SPDT, 0MHz Min, 3500MHz Max, 1 Func, 1.1dB Insertion Loss-Max, ROHS COMPLIANT, ULTRA SMALL, PLASTIC, SMT, MSOP-8 HMC284MS8G vs HMC284MS8GETR

HMC284MS8G Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance. Thermal management involves using a heat sink or thermal pad to dissipate heat, and ensuring good airflow around the device.

  • Optimizing the input and output matching networks involves using a combination of simulation tools and empirical methods to achieve the best possible impedance match. This may involve using a network analyzer to measure the device's S-parameters and then using a simulation tool to optimize the matching network.

  • The recommended operating conditions include operating the device within its specified voltage and current limits, avoiding exposure to extreme temperatures, and ensuring good thermal management. It's also important to follow proper handling and storage procedures to prevent damage from electrostatic discharge (ESD).

  • Troubleshooting common issues involves using a combination of measurement tools such as a spectrum analyzer and a network analyzer, as well as simulation tools to model the circuit behavior. It's also important to follow a systematic approach to identify and isolate the root cause of the issue.

  • Operating the device outside of its specified frequency range can result in reduced performance, instability, or even damage to the device. It's important to ensure that the device is operated within its specified frequency range to ensure optimal performance and reliability.