Part Details for HM66WP18513BP-65 by Renesas Electronics Corporation
Overview of HM66WP18513BP-65 by Renesas Electronics Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for HM66WP18513BP-65
HM66WP18513BP-65 CAD Models
HM66WP18513BP-65 Part Data Attributes:
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HM66WP18513BP-65
Renesas Electronics Corporation
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Datasheet
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HM66WP18513BP-65
Renesas Electronics Corporation
512KX18 ZBT SRAM, 6.5ns, PBGA119, BGA-119
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Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 119 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 6.5 ns | |
Additional Feature | FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e1 | |
Length | 22 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.35 mm | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |