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Overview of HM66AEB9405BP-33 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
CAD Models for HM66AEB9405BP-33 by Renesas Electronics Corporation
Part Data Attributes for HM66AEB9405BP-33 by Renesas Electronics Corporation
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA, BGA165,11X15,40
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
0.45 ns
|
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
|
I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e1
|
|
Length
|
17 mm
|
|
Memory Density
|
37748736 bit
|
|
Memory IC Type
|
DDR SRAM
|
|
Memory Width
|
9
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
4194304 words
|
|
Number of Words Code
|
4000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
4MX9
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.46 mm
|
|
Standby Current-Max
|
0.33 A
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.84 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
15 mm
|
Alternate Parts for HM66AEB9405BP-33
This table gives cross-reference parts and alternative options found for HM66AEB9405BP-33. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM66AEB9405BP-33, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8672Q18AE-333 | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | GSI Technology | HM66AEB9405BP-33 vs GS8672Q18AE-333 |
| GS8662T20BD-350 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | HM66AEB9405BP-33 vs GS8662T20BD-350 |
| GS81302D37AE-350 | DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | HM66AEB9405BP-33 vs GS81302D37AE-350 |
| CY7C1665KV18-550BZXC | QDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | HM66AEB9405BP-33 vs CY7C1665KV18-550BZXC |
| CY7C1513JV18-250BZXC | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | HM66AEB9405BP-33 vs CY7C1513JV18-250BZXC |
| CY7C1610KV18-300BZI | QDR SRAM, 16MX8, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | Cypress Semiconductor | HM66AEB9405BP-33 vs CY7C1610KV18-300BZI |
| GS81302D06GE-500 | DDR SRAM, 16MX8, 0.37ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | HM66AEB9405BP-33 vs GS81302D06GE-500 |
| CY7C1425V18-167BZC | QDR SRAM, 4MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 | Cypress Semiconductor | HM66AEB9405BP-33 vs CY7C1425V18-167BZC |
| GS8342D20BD-550 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | HM66AEB9405BP-33 vs GS8342D20BD-550 |
| CY7C1610KV18-250BZXI | QDR SRAM, 16MX8, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 | Cypress Semiconductor | HM66AEB9405BP-33 vs CY7C1610KV18-250BZXI |