Part Details for HM64YLB36512BP-28 by Renesas Electronics Corporation
Overview of HM64YLB36512BP-28 by Renesas Electronics Corporation
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Part Details for HM64YLB36512BP-28
HM64YLB36512BP-28 CAD Models
HM64YLB36512BP-28 Part Data Attributes
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HM64YLB36512BP-28
Renesas Electronics Corporation
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Datasheet
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HM64YLB36512BP-28
Renesas Electronics Corporation
512KX36 LATE-WRITE SRAM, 1.6ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
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Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA119,7X17,50 | |
Pin Count | 119 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 1.6 ns | |
Clock Frequency-Max (fCLK) | 357 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e1 | |
Length | 22 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | LATE-WRITE SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA119,7X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.24 mm | |
Standby Current-Max | 0.15 A | |
Standby Voltage-Min | 2.38 V | |
Supply Current-Max | 0.45 mA | |
Supply Voltage-Max (Vsup) | 2.63 V | |
Supply Voltage-Min (Vsup) | 2.38 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |