Datasheets
HM6207HLP-25 by:

IC,SRAM,256KX1,CMOS,DIP,24PIN,PLASTIC

Part Details for HM6207HLP-25 by Renesas Electronics Corporation

Overview of HM6207HLP-25 by Renesas Electronics Corporation

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for HM6207HLP-25

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HM6207HLP-25 Part Data Attributes

HM6207HLP-25 Renesas Electronics Corporation
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HM6207HLP-25 Renesas Electronics Corporation IC,SRAM,256KX1,CMOS,DIP,24PIN,PLASTIC
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-24
Pin Count 24
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 25 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP
I/O Type SEPARATE
JESD-30 Code R-PDIP-T24
JESD-609 Code e0
Length 29.88 mm
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 1
Number of Functions 1
Number of Terminals 24
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.0001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for HM6207HLP-25

This table gives cross-reference parts and alternative options found for HM6207HLP-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM6207HLP-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MSM1256TI-25 Standard SRAM, 256KX1, 25ns, BICMOS, CDIP24 Mosaic Semiconductor Inc HM6207HLP-25 vs MSM1256TI-25
HX6156NEFT IC 256K X 1 STANDARD SRAM, 25 ns, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28, Static RAM Honeywell Sensing and Control HM6207HLP-25 vs HX6156NEFT
MT5C2561C-25L/883C Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Micross Components HM6207HLP-25 vs MT5C2561C-25L/883C
P4C1257-25PC Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Pyramid Semiconductor Corporation HM6207HLP-25 vs P4C1257-25PC
HMU-65797H-9 Standard SRAM, 256KX1, 25ns, CMOS, PDSO24 Matra MHS HM6207HLP-25 vs HMU-65797H-9
HX6156NEGT Standard SRAM, 256KX1, 25ns, CMOS, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28 Honeywell Microelectronics & Precision Sensors HM6207HLP-25 vs HX6156NEGT
EDI81257CA25RI Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, Electronic Designs Inc HM6207HLP-25 vs EDI81257CA25RI
HX6156NQFT IC 256K X 1 STANDARD SRAM, 25 ns, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28, Static RAM Honeywell Sensing and Control HM6207HLP-25 vs HX6156NQFT
EDI81256PA25QC Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, Electronic Designs Inc HM6207HLP-25 vs EDI81256PA25QC
HX6856/1P1NYT Standard SRAM, 256KX1, 25ns, CMOS, CDFP28, 0.530 X 0.720 INCH, CERAMIC, FP-28 Honeywell Microelectronics & Precision Sensors HM6207HLP-25 vs HX6856/1P1NYT

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