We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In
Memory / SRAMs / HM6167HP-45
Datasheets
HM6167HP-45 by:
Hitachi Ltd
Hitachi Ltd
Renesas Electronics Corporation
Not Found

Standard SRAM, 16KX1, 45ns, CMOS, PDIP20

Part Details for HM6167HP-45 by Hitachi Ltd

Results Overview of HM6167HP-45 by Hitachi Ltd

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

HM6167HP-45 Information

HM6167HP-45 by Hitachi Ltd is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for HM6167HP-45

Part # Distributor Description Stock Price Buy
Bristol Electronics   Min Qty: 1 277
  • 1 $8.7360
  • 4 $5.6784
  • 10 $4.3680
  • 30 $4.0771
  • 63 $3.7853
  • 127 $3.5818
$3.5818 / $8.7360 Buy Now
Quest Components   2451
  • 1 $14.0850
  • 116 $7.7468
  • 259 $7.0425
$7.0425 / $14.0850 Buy Now
Quest Components   12
  • 1 $11.7000
  • 2 $7.8000
  • 4 $5.8500
$5.8500 / $11.7000 Buy Now

Part Details for HM6167HP-45

HM6167HP-45 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

HM6167HP-45 Part Data Attributes

Parametric Data
HM6167HP-45 Hitachi Ltd
Buy Now Datasheet
Compare Parts:
HM6167HP-45 Hitachi Ltd Standard SRAM, 16KX1, 45ns, CMOS, PDIP20
Select a part to compare:
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer HITACHI LTD
Package Description DIP-20
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 45 ns
I/O Type SEPARATE
JESD-30 Code R-PDIP-T20
JESD-609 Code e0
Memory Density 16384 bit
Memory IC Type STANDARD SRAM
Memory Width 1
Number of Terminals 20
Number of Words 16384 words
Number of Words Code 16000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

HM6167HP-45 Related Parts

HM6167HP-45 Frequently Asked Questions (FAQ)

  • Hitachi recommends a 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended for the power planes.

  • To ensure reliable data retention, it's essential to follow the recommended power-down sequence, which includes writing all data to the memory array, disabling the write enable signal, and then powering down the device. Additionally, using a capacitor to filter the power supply and a pull-up resistor on the write enable signal can help prevent data corruption.

  • The HM6167HP-45 is rated for operation up to 85°C, but it's essential to consider the derating of the device's performance and reliability at higher temperatures. Ensure proper thermal management, and consider using thermal interface materials and heat sinks to maintain a safe operating temperature.

  • To troubleshoot issues, start by verifying the power supply and clock signals, then check the device's configuration and programming. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Consult the datasheet and application notes for guidance on specific troubleshooting procedures.

  • To minimize EMI and EMC issues, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the edges, and use shielding or filtering components as necessary. Ensure proper decoupling of the power supply and use a common mode choke to reduce emissions.