Part Details for HM5225645FBP-B60 by Hitachi Ltd
Overview of HM5225645FBP-B60 by Hitachi Ltd
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Part Details for HM5225645FBP-B60
HM5225645FBP-B60 CAD Models
HM5225645FBP-B60 Part Data Attributes
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HM5225645FBP-B60
Hitachi Ltd
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HM5225645FBP-B60
Hitachi Ltd
Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA108, 14 X 22 MM, 1.27 MM PITCH, BUMP, BGA-108
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 108 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 6 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B108 | |
| Length | 22 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 64 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 108 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |