Datasheets
HM4-6617-9 by:

2KX8 OTPROM, 140ns, CQCC32, CERAMIC, LCC-32

Part Details for HM4-6617-9 by Intersil Corporation

Overview of HM4-6617-9 by Intersil Corporation

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Part Details for HM4-6617-9

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HM4-6617-9 Part Data Attributes:

HM4-6617-9 Intersil Corporation
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HM4-6617-9 Intersil Corporation 2KX8 OTPROM, 140ns, CQCC32, CERAMIC, LCC-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTERSIL CORP
Part Package Code QFJ
Package Description QCCN, LCC32,.45X.55
Pin Count 32
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 140 ns
JESD-30 Code R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 16384 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 3.05 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.046 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for HM4-6617-9

This table gives cross-reference parts and alternative options found for HM4-6617-9. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM4-6617-9, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HM4-6617-9 OTP ROM, 2KX8, 140ns, CMOS, CQCC32 Harris Semiconductor HM4-6617-9 vs HM4-6617-9
HM4-6617/883 2KX8 OTPROM, 140ns, CQCC32 Intersil Corporation HM4-6617-9 vs HM4-6617/883
HM4-6617-8 OTP ROM, 2KX8, 140ns, CMOS, CQCC32 Harris Semiconductor HM4-6617-9 vs HM4-6617-8
HM4-6617-8 2KX8 OTPROM, 140ns, CQCC32 Intersil Corporation HM4-6617-9 vs HM4-6617-8
Part Number Description Manufacturer Compare
AM2716B-300LC UVPROM, 2KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM2716B-300LC
AM27LS191A/BUC OTP ROM, 2KX8, 45ns, Bipolar, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM27LS191A/BUC
AM2716B-105LC UVPROM, 2KX8, 100ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM2716B-105LC
X2816CEMB-90 EEPROM, 2KX8, 90ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc HM4-6617-9 vs X2816CEMB-90
AM27S191/BUC OTP ROM, 2KX8, 65ns, Bipolar, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM27S191/BUC
AM2716B-455LC UVPROM, 2KX8, 450ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM2716B-455LC
X2816AEMB-45 EEPROM, 2KX8, 450ns, Parallel, MOS, CQCC32, Xicor Inc HM4-6617-9 vs X2816AEMB-45
X2816CEI-12T1 EEPROM, 2KX8, 120ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc HM4-6617-9 vs X2816CEI-12T1
AM27S191LCB OTP ROM, 2KX8, 50ns, Bipolar, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM27S191LCB
AM27S45/BUC OTP ROM, 2KX8, Bipolar, CQCC32, CERAMIC, LCC-32 AMD HM4-6617-9 vs AM27S45/BUC

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