Datasheets
HM1-6514B-8 by:

Standard SRAM, 1KX4, 220ns, CMOS, CDIP18

Part Details for HM1-6514B-8 by Harris Semiconductor

Overview of HM1-6514B-8 by Harris Semiconductor

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Education and Research Industrial Automation Electronic Manufacturing

Available Datasheets

Part # Manufacturer Description Datasheet
HM1-6516B/B Rochester Electronics LLC HM1-6516 - Standard SRAM, 2KX8, 200ns, CMOS
HM1-6504/B Rochester Electronics LLC HM1-6504 - Standard SRAM, 256X4, 300ns, CMOS
R5F56514BDLJ#20 Renesas Electronics Corporation 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities

Price & Stock for HM1-6514B-8

Part # Distributor Description Stock Price Buy
Quest Components 1K X 4 STANDARD SRAM, 220 ns, CDIP18 5
  • 1 $19.5000
$19.5000 Buy Now
Quest Components 1K X 4 STANDARD SRAM, 220 ns, CDIP18 4
  • 1 $30.0000
$30.0000 Buy Now

Part Details for HM1-6514B-8

HM1-6514B-8 CAD Models

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HM1-6514B-8 Part Data Attributes

HM1-6514B-8 Harris Semiconductor
Buy Now Datasheet
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HM1-6514B-8 Harris Semiconductor Standard SRAM, 1KX4, 220ns, CMOS, CDIP18
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR
Package Description DIP, DIP18,.3
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
kg CO2e/kg 12
Average Weight (mg) 3725.85
CO2e (mg) 44710.201
Category CO2 Kg 12
Compliance Temperature Grade Military: -55C to +125C
Access Time-Max 220 ns
Additional Feature TTL COMPATIBLE INPUT/OUTPUT; ON CHIP ADDRESS REGISTER; LOW POWER STANDBY
I/O Type COMMON
JESD-30 Code R-GDIP-T18
JESD-609 Code e0
Memory Density 4096 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Terminals 18
Number of Words 1024 words
Number of Words Code 1000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 1KX4
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.000025 A
Standby Voltage-Min 2 V
Supply Current-Max 0.019 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for HM1-6514B-8

This table gives cross-reference parts and alternative options found for HM1-6514B-8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM1-6514B-8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HM1-6514B/883 1KX4 STANDARD SRAM, 220ns, CDIP18, CERAMIC, DIP-18 Intersil Corporation HM1-6514B-8 vs HM1-6514B/883
HM1-6514B-9 1KX4 STANDARD SRAM, 200ns, CDIP18 Intersil Corporation HM1-6514B-8 vs HM1-6514B-9
HM1-6514B-9 Standard SRAM, 1KX4, 200ns, CMOS, CDIP18 Rochester Electronics LLC HM1-6514B-8 vs HM1-6514B-9
HM3-6514B-9 1KX4 STANDARD SRAM, 220ns, PDIP18, PLASTIC, DIP-18 Intersil Corporation HM1-6514B-8 vs HM3-6514B-9
HM1-6514B/883 Standard SRAM, 1KX4, 220ns, CMOS, CDIP18 Harris Semiconductor HM1-6514B-8 vs HM1-6514B/883
HM3-6514B-9 Standard SRAM, 1KX4, 200ns, CMOS, PDIP18 Harris Semiconductor HM1-6514B-8 vs HM3-6514B-9
Part Number Description Manufacturer Compare
6167LA15D Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20 Integrated Device Technology Inc HM1-6514B-8 vs 6167LA15D
AM100470ADCB Standard SRAM, 4KX1, 25ns, ECL, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 AMD HM1-6514B-8 vs AM100470ADCB
IDT6167LA25SO8 Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, 0.300 INCH, SOIC-20 Integrated Device Technology Inc HM1-6514B-8 vs IDT6167LA25SO8
6167LA35D Standard SRAM, 16KX1, 35ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20 Integrated Device Technology Inc HM1-6514B-8 vs 6167LA35D
L7C167KC20 Standard SRAM, 16KX1, 20ns, CMOS, CQCC20, 0.290 X 0.425 INCH, CERAMIC, LCC-20 LOGIC Devices Inc HM1-6514B-8 vs L7C167KC20
CY7C167-25VCR Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, PLASTIC, SOJ-20 Cypress Semiconductor HM1-6514B-8 vs CY7C167-25VCR
CY7C147-45LC Standard SRAM, 4KX1, 45ns, CMOS, CQCC18, CERAMIC, LCC-18 Cypress Semiconductor HM1-6514B-8 vs CY7C147-45LC
8413202YX Standard SRAM, 16KX1, 45ns, CMOS, 0.440 X 0.305 INCH, 0.120 INCH HEIGHT, LCC-20 Cypress Semiconductor HM1-6514B-8 vs 8413202YX
HM465767BH-5:R Standard SRAM, 16KX1, 25ns, CMOS, CQCC20, LCC-20 Atmel Corporation HM1-6514B-8 vs HM465767BH-5:R
IDT6167SA70FB Standard SRAM, 16KX1, 70ns, CMOS, CDFP20, FP-20 Integrated Device Technology Inc HM1-6514B-8 vs IDT6167SA70FB

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