Part Details for HEF4001BPN by Philips Semiconductors
Overview of HEF4001BPN by Philips Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
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Applications
Education and Research
Financial Technology (Fintech)
Healthcare
Part Details for HEF4001BPN
HEF4001BPN CAD Models
HEF4001BPN Part Data Attributes:
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HEF4001BPN
Philips Semiconductors
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Datasheet
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HEF4001BPN
Philips Semiconductors
NOR Gate, CMOS, PDIP14,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Package Description | DIP, DIP14,.3 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PDIP-T14 | |
| JESD-609 Code | e4 | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | NOR GATE | |
| Max I(ol) | 0.00035999999999999997 A | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP14,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Prop. Delay@Nom-Sup | 120 ns | |
| Qualification Status | Not Qualified | |
| Schmitt Trigger | NO | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |