There are no models available for this part yet.
Overview of HD74HC157TELL-E by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Financial Technology (Fintech)
Computing and Data Storage
Telecommunications
Communication and Networking
Price & Stock for HD74HC157TELL-E by Renesas Electronics Corporation
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Quest Components | 352 |
|
$0.5560 / $1.3900 | Buy Now |
CAD Models for HD74HC157TELL-E by Renesas Electronics Corporation
Part Data Attributes for HD74HC157TELL-E by Renesas Electronics Corporation
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Package Description
|
TSSOP, TSSOP16,.25
|
|
Reach Compliance Code
|
compliant
|
|
HTS Code
|
8542.39.00.01
|
|
JESD-30 Code
|
R-PDSO-G16
|
|
Load Capacitance (CL)
|
50 pF
|
|
Logic IC Type
|
MULTIPLEXER
|
|
Max I(ol)
|
0.004 A
|
|
Number of Functions
|
4
|
|
Number of Inputs
|
2
|
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Number of Terminals
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16
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
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|
Package Code
|
TSSOP
|
|
Package Equivalence Code
|
TSSOP16,.25
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|
Package Shape
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RECTANGULAR
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Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Packing Method
|
TR
|
|
Prop. Delay@Nom-Sup
|
31 ns
|
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Qualification Status
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Not Qualified
|
|
Surface Mount
|
YES
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|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
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|
Terminal Form
|
GULL WING
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|
Terminal Pitch
|
0.635 mm
|
|
Terminal Position
|
DUAL
|