There are no models available for this part yet.
Overview of HD64F2317VTE25 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for HD64F2317VTE25 by Renesas Electronics Corporation
Part Data Attributes for HD64F2317VTE25 by Renesas Electronics Corporation
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
|
Part Package Code
|
QFP
|
Pin Count
|
100
|
Reach Compliance Code
|
unknown
|
Bit Size
|
16
|
CPU Family
|
H8S/2000
|
JESD-30 Code
|
S-PQFP-G100
|
Number of Terminals
|
100
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
-20 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Equivalence Code
|
TQFP100,.63SQ
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
8192
|
ROM (words)
|
131072
|
ROM Programmability
|
FLASH
|
Speed
|
25 MHz
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
QUAD
|