Part Details for HD64F2218UBR24 by Renesas Electronics Corporation
Overview of HD64F2218UBR24 by Renesas Electronics Corporation
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Part Details for HD64F2218UBR24
HD64F2218UBR24 CAD Models
HD64F2218UBR24 Part Data Attributes
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HD64F2218UBR24
Renesas Electronics Corporation
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Datasheet
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HD64F2218UBR24
Renesas Electronics Corporation
16-BIT, FLASH, 24MHz, MICROCONTROLLER, PBGA112, 10 X 10 MM, 0.80 MM PITCH, PLASTIC, LFBGA-112
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | 10 X 10 MM, 0.80 MM PITCH, PLASTIC, LFBGA-112 | |
Pin Count | 112 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Additional Feature | ALSO OPERATES AT 2.4V MINIMUM SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 16 | |
CPU Family | H8S/2000 | |
Clock Frequency-Max | 24 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PBGA-B112 | |
Length | 10 mm | |
Number of I/O Lines | 69 | |
Number of Terminals | 112 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA112,11X11,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (bytes) | 12288 | |
ROM (words) | 131072 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.4 mm | |
Speed | 24 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |