Part Details for HD6432266WAXXTF by Renesas Electronics Corporation
Overview of HD6432266WAXXTF by Renesas Electronics Corporation
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Applications
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for HD6432266WAXXTF
HD6432266WAXXTF CAD Models
HD6432266WAXXTF Part Data Attributes
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HD6432266WAXXTF
Renesas Electronics Corporation
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Datasheet
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HD6432266WAXXTF
Renesas Electronics Corporation
16-BIT, MROM, 13.5MHz, MICROCONTROLLER, PQFP100, 12 X 12 MM, 0.40 MM PITCH, TQFP-100
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS TECHNOLOGY CORP | |
Part Package Code | QFP | |
Package Description | TFQFP, TQFP100,.55SQ,16 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
Boundary Scan | NO | |
CPU Family | H8S/2000 | |
Clock Frequency-Max | 13.5 MHz | |
DAC Channels | YES | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e0 | |
Length | 12 mm | |
Number of I/O Lines | 78 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.55SQ,16 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 8192 | |
ROM (words) | 65536 | |
ROM Programmability | MROM | |
Seated Height-Max | 1.2 mm | |
Speed | 13.5 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.4 mm | |
Terminal Position | QUAD | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |