Part Details for HD63B09P by Hitachi Ltd
Overview of HD63B09P by Hitachi Ltd
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for HD63B09P
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 8 |
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RFQ | ||
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ComSIT USA | CMOS MICRO PROCESSING UNIT Microprocessor, 8-Bit, 2MHz, CMOS, PDIP40 RoHS: Not Compliant | Europe - 10 |
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RFQ |
Part Details for HD63B09P
HD63B09P CAD Models
HD63B09P Part Data Attributes
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HD63B09P
Hitachi Ltd
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Datasheet
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HD63B09P
Hitachi Ltd
Microprocessor, 8-Bit, 2MHz, CMOS, PDIP40, PLASTIC, DIP-40
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-40 | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | HITACHI | |
| Address Bus Width | 16 | |
| Bit Size | 8 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 8 MHz | |
| External Data Bus Width | 8 | |
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | R-PDIP-T40 | |
| JESD-609 Code | e0 | |
| Length | 52.8 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | ||
| Number of External Interrupts | 3 | |
| Number of Serial I/Os | ||
| Number of Terminals | 40 | |
| On Chip Data RAM Width | ||
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| RAM (words) | 0 | |
| Seated Height-Max | 5.08 mm | |
| Speed | 2 MHz | |
| Supply Current-Max | 24 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for HD63B09P
This table gives cross-reference parts and alternative options found for HD63B09P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HD63B09P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| G65SC12AP-6 | Microprocessor, 8-Bit, 6MHz, CMOS, PDIP40, PLASTIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC12AP-6 |
| G65SC02-AP-6 | Microprocessor, 8-Bit, 6MHz, CMOS, PDIP40, PLASTIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC02-AP-6 |
| G65SC02-ADS-1 | Microprocessor, 8-Bit, 1MHz, CMOS, CDIP40, CERDIP-40 | California Micro Devices | HD63B09P vs G65SC02-ADS-1 |
| G65SC2CS-2 | Microprocessor, 8-Bit, 2MHz, CMOS, CDIP40, CERAMIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC2CS-2 |
| NSC800D-1/A+ | 8-BIT, 1MHz, MICROPROCESSOR, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 | Texas Instruments | HD63B09P vs NSC800D-1/A+ |
| SAB8088-2-P | Microprocessor, 8-Bit, 8MHz, NMOS, PDIP40, PLASTIC, DIP-40 | Infineon Technologies AG | HD63B09P vs SAB8088-2-P |
| G65SC12PW-2 | Microprocessor, 8-Bit, 2MHz, CMOS, PDIP40, PLASTIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC12PW-2 |
| G65SC112APS-6 | Microprocessor, 8-Bit, 6MHz, CMOS, PDIP40, PLASTIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC112APS-6 |
| 2650 | 8-BIT, 1.25MHz, MICROPROCESSOR, PDIP40 | Philips Semiconductors | HD63B09P vs 2650 |
| G65SC12AC-5 | Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, CERAMIC, DIP-40 | California Micro Devices | HD63B09P vs G65SC12AC-5 |