Part Details for HCF4007UBF by STMicroelectronics
Overview of HCF4007UBF by STMicroelectronics
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Communication and Networking
Part Details for HCF4007UBF
HCF4007UBF CAD Models
HCF4007UBF Part Data Attributes
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HCF4007UBF
STMicroelectronics
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HCF4007UBF
STMicroelectronics
HCF4007UBF
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-XDIP-T14 | |
JESD-609 Code | e0 | |
Number of Terminals | 14 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP14,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |