Part Details for HCC4053BF by STMicroelectronics
Overview of HCC4053BF by STMicroelectronics
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- Part Data Attributes: (Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for HCC4053BF
HCC4053BF CAD Models
HCC4053BF Part Data Attributes:
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HCC4053BF
STMicroelectronics
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Datasheet
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HCC4053BF
STMicroelectronics
TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, CDIP14, FRIT SEALED, CERAMIC, DIP-14
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 14 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Analog IC - Other Type | SINGLE-ENDED MULTIPLEXER | |
| JESD-30 Code | R-GDIP-T14 | |
| JESD-609 Code | e0 | |
| Neg Supply Voltage-Nom (Vsup) | ||
| Number of Channels | 2 | |
| Number of Functions | 3 | |
| Number of Terminals | 14 | |
| Off-state Isolation-Nom | 40 dB | |
| On-state Resistance Match-Nom | 5 Ω | |
| On-state Resistance-Max (Ron) | 280 Ω | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Signal Current-Max | 0.01 A | |
| Supply Current-Max (Isup) | 3 mA | |
| Supply Voltage-Nom (Vsup) | 15 V | |
| Surface Mount | NO | |
| Switch-off Time-Max | 160 ns | |
| Switch-on Time-Max | 240 ns | |
| Switching | BREAK-BEFORE-MAKE | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |