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Overview of H8FASDRJCMJR-4HM by SK Hynix Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for H8FASDRJCMJR-4HM by SK Hynix Inc
Part Data Attributes for H8FASDRJCMJR-4HM by SK Hynix Inc
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|
---|---|
Part Life Cycle Code
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Active
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Ihs Manufacturer
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SK HYNIX INC
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Package Description
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FBGA-199
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
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8542.32.00.71
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Additional Feature
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SEATED HT-CALCULATED AND NAND FLASH IS ORGANISED AS 256MX8 AND SDRAM IS ORGANISED AS 32MX32
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JESD-30 Code
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R-PBGA-B199
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Length
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18 mm
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Memory Density
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34359738368 bit
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Memory IC Type
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MEMORY CIRCUIT
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Memory Width
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4
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Number of Functions
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1
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Number of Terminals
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199
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Number of Words
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8589934592 words
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Number of Words Code
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8000000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-30 °C
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Organization
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8GX4
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LFBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, LOW PROFILE, FINE PITCH
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Seated Height-Max
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1.4 mm
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Supply Voltage-Max (Vsup)
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3.6 V
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Supply Voltage-Min (Vsup)
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2.7 V
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Pitch
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0.65 mm
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Terminal Position
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BOTTOM
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Width
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12 mm
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