Part Details for H2772 by American Microsemiconductor Inc
Overview of H2772 by American Microsemiconductor Inc
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Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
L17H2772231 | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15HD/15HD (Socket/Socket), 0.76m (30 in) Gold, Nickel Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock | |
L17H2772120 | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15 High Density/15 High Density (Socket/Socket), 0.76m (30 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock | |
L17H2772231HT | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15HD/15HD (Socket/Socket), 0.76m (30 in) Gold, Nickel Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock, High Temp |