Part Details for GX1-300B-85-2.0 by National Semiconductor Corporation
Overview of GX1-300B-85-2.0 by National Semiconductor Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for GX1-300B-85-2.0
| Part # | Distributor | Description | Stock | Price | Buy | |
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Velocity Electronics | Our Stock | 11 |
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RFQ | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 13 |
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Part Details for GX1-300B-85-2.0
GX1-300B-85-2.0 CAD Models
GX1-300B-85-2.0 Part Data Attributes:
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GX1-300B-85-2.0
National Semiconductor Corporation
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Datasheet
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GX1-300B-85-2.0
National Semiconductor Corporation
Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | BGA-352 | |
| Reach Compliance Code | not_compliant | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 33 MHz | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B352 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 352 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.23 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |