Datasheets
GS9035CCPJ by:
Gennum Corporation
Gennum Corporation
Semtech Corporation
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Consumer IC,

Part Details for GS9035CCPJ by Gennum Corporation

Results Overview of GS9035CCPJ by Gennum Corporation

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Price & Stock for GS9035CCPJ

Part # Distributor Description Stock Price Buy
DISTI # 2156-GS9035CCPJ-ND
DigiKey IC SER DIGITAL RECLOCKER 28-PLCC Min Qty: 26 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 7543
In Stock
  • 26 $11.9800
$11.9800 Buy Now
Rochester Electronics GENLINX II, Serial Digital Reclocke RoHS: Not Compliant Status: Obsolete Min Qty: 1 7543
  • 1 $11.5200
  • 25 $11.2900
  • 100 $10.8300
  • 500 $10.3700
  • 1,000 $9.7900
$9.7900 / $11.5200 Buy Now

Part Details for GS9035CCPJ

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GS9035CCPJ Part Data Attributes

GS9035CCPJ Gennum Corporation
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GS9035CCPJ Gennum Corporation Consumer IC,
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Part Life Cycle Code Transferred
Ihs Manufacturer GENNUM CORP
Reach Compliance Code unknown
HTS Code 8542.39.00.01

GS9035CCPJ Frequently Asked Questions (FAQ)

  • A good PCB layout for the GS9035CCPJ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing signal trace lengths and loops. It's also recommended to place the device near the signal source and use a low-impedance power supply.

  • To ensure proper powering and decoupling, use a low-impedance power supply, and decouple the device with 0.1uF and 10uF capacitors between VCC and GND, placed as close to the device as possible. Additionally, use a 10nF capacitor between VCC and AVCC for analog power supply decoupling.

  • The GS9035CCPJ can support clock frequencies up to 1.485 Gbps, but the actual maximum frequency may vary depending on the specific application, PCB layout, and signal quality.

  • The GS9035CCPJ can be configured for different data rates and protocols using the device's control pins and registers. Refer to the datasheet and application notes for specific configuration details and examples.

  • The GS9035CCPJ has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or thermal pad, and ensure good airflow around the device. Avoid exposing the device to high temperatures during soldering or rework.