There are no models available for this part yet.
Overview of GS882Z36CGD-250 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 2 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for GS882Z36CGD-250 by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS882Z36CGD-250
|
Avnet Americas | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 5.5ns/2.5ns 165-Pin FBGA Tray - Trays (Alt: GS882Z36CGD-250) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Container: Tray | 0 |
|
$10.0500 / $12.3750 | Buy Now | |
DISTI #
464-GS882Z36CGD-250
|
Mouser Electronics | SRAM 2.5 or 3.3V 256K x 36 9M RoHS: Compliant | 0 |
|
$10.6000 / $11.2800 | Order Now | |
DISTI #
GS882Z36CGD-250
|
Avnet Silica | (Alt: GS882Z36CGD-250) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
CAD Models for GS882Z36CGD-250 by GSI Technology
Part Data Attributes for GS882Z36CGD-250 by GSI Technology
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
5.5 ns
|
Additional Feature
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Memory Density
|
9437184 bit
|
Memory IC Type
|
ZBT SRAM
|
Memory Width
|
36
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
262144 words
|
Number of Words Code
|
256000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
256KX36
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
13 mm
|
Alternate Parts for GS882Z36CGD-250
This table gives cross-reference parts and alternative options found for GS882Z36CGD-250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS882Z36CGD-250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS882Z36CD-250I | ZBT SRAM, 256KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS882Z36CGD-250 vs GS882Z36CD-250I |
GS882Z36CD-250 | ZBT SRAM, 256KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS882Z36CGD-250 vs GS882Z36CD-250 |