There are no models available for this part yet.
Overview of GS88218CD-300I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LT8300IS5#TRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LT8300IS5#WTRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LTC3300IUK-2#TRPBF | Analog Devices | Addressable Hi Eff Bi-dir Mult |
Price & Stock for GS88218CD-300I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS88218CD-300I
|
Avnet Americas | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5ns/2.5ns 165-Pin FBGA - Trays (Alt: GS88218CD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$21.0648 / $25.9380 | Buy Now | |
DISTI #
464-GS88218CD-300I
|
Mouser Electronics | SRAM 2.5 or 3.3V 512K x 18 9M | 0 |
|
$22.2100 / $24.7900 | Order Now |
CAD Models for GS88218CD-300I by GSI Technology
Part Data Attributes for GS88218CD-300I by GSI Technology
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
24 Weeks
|
Access Time-Max
|
5 ns
|
Additional Feature
|
PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e0
|
Length
|
15 mm
|
Memory Density
|
9437184 bit
|
Memory IC Type
|
CACHE SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512KX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
13 mm
|
Alternate Parts for GS88218CD-300I
This table gives cross-reference parts and alternative options found for GS88218CD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS88218CD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS88218CGD-300 | Cache SRAM, 512KX18, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS88218CD-300I vs GS88218CGD-300 |
GS88218CD-300 | Cache SRAM, 512KX18, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS88218CD-300I vs GS88218CD-300 |