Part Details for GS8692QT37CE-250MQ by GSI Technology
Overview of GS8692QT37CE-250MQ by GSI Technology
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for GS8692QT37CE-250MQ
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8692QT37CE-250MQ
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Avnet Americas | SRAM Chip Synchronous 1.8V 72M-bit 2M x 36 250MHz 165-Pin CCGA - Trays (Alt: GS8692QT37CE-250MQ) RoHS: Not Compliant Min Qty: 5 Package Multiple: 1 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for GS8692QT37CE-250MQ
GS8692QT37CE-250MQ CAD Models
GS8692QT37CE-250MQ Part Data Attributes
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GS8692QT37CE-250MQ
GSI Technology
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Datasheet
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GS8692QT37CE-250MQ
GSI Technology
DDR SRAM,
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | CGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 9A515.E.1 | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| JESD-30 Code | R-CBGA-X165 | |
| Length | 25 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR II PLUS SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2MX36 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 4.155 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Total Dose | 200k Rad(Si) V | |
| Width | 21 mm |