Datasheets
GS8673ET18BGK-675I by: GSI Technology

DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260

Part Details for GS8673ET18BGK-675I by GSI Technology

Overview of GS8673ET18BGK-675I by GSI Technology

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Applications Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Electronic Manufacturing Telecommunications Automotive

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Price & Stock for GS8673ET18BGK-675I

Part # Distributor Description Stock Price Buy
DISTI # 2364-GS8673ET18BGK-675I-ND
DigiKey IC SRAM 72MBIT PAR 675MHZ 260BGA Min Qty: 8 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 8 $314.4225
$314.4225 Buy Now
DISTI # GS8673ET18BGK-675I
Avnet Americas SRAM Chip Sync Dual 1.35V 72M-Bit 4M x 18 0.4ns 260-Pin BGA Bulk - Bulk (Alt: GS8673ET18BGK-675I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Bulk 0
  • 84 $355.6080
  • 168 $349.1424
  • 336 $331.9008
  • 504 $323.2800
  • 672 $312.5040
  • 840 $297.4176
  • 8,400 $288.7968
$288.7968 / $355.6080 Buy Now
DISTI # 464-8673ET18BGK675I
Mouser Electronics SRAM 1.2/1.5V 4M x 18 72M RoHS: Compliant 0
  • 8 $298.7000
  • 24 $295.0800
$295.0800 / $298.7000 Order Now

Part Details for GS8673ET18BGK-675I

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GS8673ET18BGK-675I Part Data Attributes

GS8673ET18BGK-675I GSI Technology
Buy Now Datasheet
Compare Parts:
GS8673ET18BGK-675I GSI Technology DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description HBGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 20 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.4 ns
JESD-30 Code R-PBGA-B260
JESD-609 Code e1
Length 22 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 260
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Organization 4MX18
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Seated Height-Max 2.3 mm
Supply Voltage-Max (Vsup) 1.4 V
Supply Voltage-Min (Vsup) 1.3 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for GS8673ET18BGK-675I

This table gives cross-reference parts and alternative options found for GS8673ET18BGK-675I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8673ET18BGK-675I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8673EQ18BGK-675I DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260 GSI Technology GS8673ET18BGK-675I vs GS8673EQ18BGK-675I
GS8673EQ18BGK-675 DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260 GSI Technology GS8673ET18BGK-675I vs GS8673EQ18BGK-675
GS8673ET18BGK-675 DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260 GSI Technology GS8673ET18BGK-675I vs GS8673ET18BGK-675

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