Part Details for GS8673ED36BGK-625S by GSI Technology
Overview of GS8673ED36BGK-625S by GSI Technology
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for GS8673ED36BGK-625S
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8673ED36BGK-625S
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Avnet Americas | SRAM Chip Sync 1.35V 72M-Bit 2M x 36 0.4ns 260-Pin BGA Bulk - Trays (Alt: GS8673ED36BGK-625S) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$226.8888 / $279.3780 | Buy Now |
DISTI #
464-8673ED36BGK625S
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Mouser Electronics | SRAM 1.2/1.5V 2M x 36 72M RoHS: Compliant | 0 |
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$227.9400 / $233.0600 | Order Now |
DISTI #
GS8673ED36BGK-625S
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Avnet Silica | BGA 260/ (Alt: GS8673ED36BGK-625S) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
GS8673ED36BGK-625S
|
Avnet Silica | SRAM Chip Sync 1.35V 72M-Bit 2M x 36 0.4ns 260-Pin BGA Bulk (Alt: GS8673ED36BGK-625S) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for GS8673ED36BGK-625S
GS8673ED36BGK-625S CAD Models
GS8673ED36BGK-625S Part Data Attributes:
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GS8673ED36BGK-625S
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8673ED36BGK-625S
GSI Technology
DDR SRAM, 2MX36, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
JESD-30 Code | R-PBGA-B260 | |
Length | 22 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 260 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 2MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 2.3 mm | |
Supply Voltage-Max (Vsup) | 1.4 V | |
Supply Voltage-Min (Vsup) | 1.3 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |