Datasheets
GS8673ED36BGK-625S by: GSI Technology

DDR SRAM, 2MX36, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260

Part Details for GS8673ED36BGK-625S by GSI Technology

Overview of GS8673ED36BGK-625S by GSI Technology

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Applications Industrial Automation Energy and Power Systems Renewable Energy Automotive

Price & Stock for GS8673ED36BGK-625S

Part # Distributor Description Stock Price Buy
DISTI # GS8673ED36BGK-625S
Avnet Americas SRAM Chip Sync 1.35V 72M-Bit 2M x 36 0.4ns 260-Pin BGA Bulk - Trays (Alt: GS8673ED36BGK-625S) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray 0
  • 84 $279.3780
  • 168 $274.2984
  • 336 $260.7528
  • 504 $253.9800
  • 672 $245.5140
  • 840 $233.6616
  • 8,400 $226.8888
$226.8888 / $279.3780 Buy Now
DISTI # 464-8673ED36BGK625S
Mouser Electronics SRAM 1.2/1.5V 2M x 36 72M RoHS: Compliant 0
  • 8 $233.0600
  • 24 $227.9400
$227.9400 / $233.0600 Order Now
DISTI # GS8673ED36BGK-625S
Avnet Silica BGA 260/ (Alt: GS8673ED36BGK-625S) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days Silica - 0
Buy Now
DISTI # GS8673ED36BGK-625S
Avnet Silica SRAM Chip Sync 1.35V 72M-Bit 2M x 36 0.4ns 260-Pin BGA Bulk (Alt: GS8673ED36BGK-625S) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days Silica - 0
Buy Now

Part Details for GS8673ED36BGK-625S

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GS8673ED36BGK-625S Part Data Attributes:

GS8673ED36BGK-625S GSI Technology
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GS8673ED36BGK-625S GSI Technology DDR SRAM, 2MX36, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
JESD-30 Code R-PBGA-B260
Length 22 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 260
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 2MX36
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Seated Height-Max 2.3 mm
Supply Voltage-Max (Vsup) 1.4 V
Supply Voltage-Min (Vsup) 1.3 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 14 mm

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