Memory
GS8672Q19BE-375I
GSI Technology
Description: QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Overview of GS8672Q19BE-375I by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation Energy and Power Systems Renewable Energy

Available Datasheets

Part # Manufacturer Description Datasheet
LT6375IMS#PBF Analog Devices ±270V Common Mode V Diff Amp
LT1375IN8#PBF Analog Devices 1.5A, 500kHz Buck Sw Regs
LT6375IMS#TRPBF Analog Devices ±270V Common Mode V Diff Amp

Price & Stock for GS8672Q19BE-375I by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS8672Q19BE-375I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672Q19BE-375I) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8672Q19BE-375I
Mouser Electronics SRAM 0
  • 1 $136.7000
  • 10 $119.1000
  • 30 $118.7700
  • 60 $115.5800
$115.5800 / $136.7000 Order Now

CAD Models for GS8672Q19BE-375I by GSI Technology
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Part Data Attributes for GS8672Q19BE-375I by GSI Technology

GS8672Q19BE-375I
GSI Technology
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA, BGA165,11X15,40
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Factory Lead Time
12 Weeks
Access Time-Max
0.45 ns
Clock Frequency-Max (fCLK)
375 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
QDR SRAM
Memory Width
18
Number of Functions
1
Number of Terminals
165
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Voltage-Min
1.7 V
Supply Current-Max
1.32 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
Want to compare parts?
  1. GS8672Q19BE-375I
    GSI Technology
    QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
    VS

Alternate Parts for GS8672Q19BE-375I

This table gives cross-reference parts and alternative options found for GS8672Q19BE-375I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672Q19BE-375I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
GS8672Q19BGE-375IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672Q19BE-375I vs GS8672Q19BGE-375IT
GS8672Q19BGE-375I QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672Q19BE-375I vs GS8672Q19BGE-375I
Part Number Description Manufacturer Compare
GS8672Q19BGE-375I QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672Q19BE-375I vs GS8672Q19BGE-375I
GS8672Q19BE-375IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672Q19BE-375I vs GS8672Q19BE-375IT

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