Part Details for GS8662S08BD-300I by GSI Technology
Overview of GS8662S08BD-300I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8662S08BD-300I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662S08BD-300I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662S08BD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$73.6464 / $90.6840 | Buy Now |
DISTI #
464-GS8662S08BD-300I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 8 64M | 0 |
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$72.2100 / $86.1500 | Order Now |
Part Details for GS8662S08BD-300I
GS8662S08BD-300I CAD Models
GS8662S08BD-300I Part Data Attributes
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GS8662S08BD-300I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662S08BD-300I
GSI Technology
Standard SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662S08BD-300I
This table gives cross-reference parts and alternative options found for GS8662S08BD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662S08BD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662Q07BD-250 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662Q07BD-250 |
UPD44644082F5-E37-FQ1-A | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | NEC Electronics Group | GS8662S08BD-300I vs UPD44644082F5-E37-FQ1-A |
GS8662DT07BGD-400T | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662DT07BGD-400T |
GS8662T07BD-300 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662T07BD-300 |
CY7C1522KV18-200BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S08BD-300I vs CY7C1522KV18-200BZXI |
GS8662DT06BGD-350IT | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662DT06BGD-350IT |
GS81302S08E-167 | DDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS81302S08E-167 |
GS8662D08GE-250IT | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662D08GE-250IT |
GS8662TT07BD-300I | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662TT07BD-300I |
GS8662Q08E-200IT | Standard SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S08BD-300I vs GS8662Q08E-200IT |