Datasheets
GS8662R09E-167I by: GSI Technology

DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165

Part Details for GS8662R09E-167I by GSI Technology

Overview of GS8662R09E-167I by GSI Technology

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Applications Space Technology Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Available Datasheets

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LT1167IS8-1#PBF Analog Devices 1x Res Gain Progmable, Prec In
LT1167IS8#TRPBF Analog Devices 1x Res Gain Progmable, Prec In
LT1167IN8#PBF Analog Devices 1x Res Gain Progmable, Prec In

Part Details for GS8662R09E-167I

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GS8662R09E-167I Part Data Attributes

GS8662R09E-167I GSI Technology
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GS8662R09E-167I GSI Technology DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.5 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX9
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for GS8662R09E-167I

This table gives cross-reference parts and alternative options found for GS8662R09E-167I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662R09E-167I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662R09E-167 DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662R09E-167
GS8662R09E-167T DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662R09E-167T
GS8662R09E-167IT DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662R09E-167IT
GS8662R09GE-167I DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662R09GE-167I
Part Number Description Manufacturer Compare
GS8662D10BGD-300 DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662D10BGD-300
GS8662T09BGD-400IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662T09BGD-400IT
GS8662R09BD-200 Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662R09BD-200
CY7C1526KV18-333BZXC QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG GS8662R09E-167I vs CY7C1526KV18-333BZXC
CY7C1529V18-278BZXC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662R09E-167I vs CY7C1529V18-278BZXC
GS8662D09GE-200T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662D09GE-200T
GS8662T10BGD-333T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662T10BGD-333T
GS8662TT10BD-300T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662TT10BD-300T
CY7C1529V18-200BZXI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662R09E-167I vs CY7C1529V18-200BZXI
GS8662S09E-167 DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 GSI Technology GS8662R09E-167I vs GS8662S09E-167

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