There are no models available for this part yet.
Overview of GS8662R09BGD-250T by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 1 replacement )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HMC463LH250TR | Analog Devices | lo Noise amp SMT w/AGC, 2 - 20 | |
| 2SJ625(0)-T1B-AT | Renesas Electronics Corporation | Power MOSFETs for Automotive | |
| X9250TS24Z-2.7T1 | Renesas Electronics Corporation | Quad Digitally Controlled Potentiometer (XDCP™) |
CAD Models for GS8662R09BGD-250T by GSI Technology
Part Data Attributes for GS8662R09BGD-250T by GSI Technology
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA, BGA165,11X15,40
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
250 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e1
|
|
Length
|
15 mm
|
|
Memory Density
|
75497472 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
9
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
8388608 words
|
|
Number of Words Code
|
8000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
8MX9
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.205 A
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.425 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
13 mm
|
Alternate Parts for GS8662R09BGD-250T
This table gives cross-reference parts and alternative options found for GS8662R09BGD-250T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662R09BGD-250T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662R09BD-250T | Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662R09BGD-250T vs GS8662R09BD-250T |