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Memory / SRAMs / GS8662Q10BD-357I
Datasheets
GS8662Q10BD-357I by: GSI Technology

DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165

Part Details for GS8662Q10BD-357I by GSI Technology

Overview of GS8662Q10BD-357I by GSI Technology

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Available Datasheets

Part # Manufacturer Description Datasheet
LTC2357ILX-18#PBF Analog Devices Bufed 4x, 18-B, 350ksps/Ch Dif
LTC4357IMS8#PBF Analog Devices Pos Hi V Ideal Diode Cntr
LTC4357IMS8#TRPBF Analog Devices Pos Hi V Ideal Diode Cntr

Price & Stock for GS8662Q10BD-357I

Part # Distributor Description Stock Price Buy
DISTI # GS8662Q10BD-357I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Bulk - Bulk (Alt: GS8662Q10BD-357I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $192.6540
  • 288 $189.1512
  • 576 $179.8104
  • 864 $175.1400
  • 1,152 $169.3020
  • 1,440 $161.1288
  • 14,400 $156.4584
$156.4584 / $192.6540 Buy Now
DISTI # 464-GS8662Q10BD-357I
Mouser Electronics SRAM 1.8 or 1.5V 8M x 9 72M 0
  • 15 $175.5800
  • 30 $175.1000
$175.1000 / $175.5800 Order Now

Part Details for GS8662Q10BD-357I

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GS8662Q10BD-357I Part Data Attributes

Parametric Data
GS8662Q10BD-357I GSI Technology
Buy Now Datasheet
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GS8662Q10BD-357I GSI Technology DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 357 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 9
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.285 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.995 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8662Q10BD-357I

This table gives cross-reference parts and alternative options found for GS8662Q10BD-357I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q10BD-357I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662Q10BD-357IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662Q10BD-357IT
GS8662Q10BGD-357I DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662Q10BGD-357I
Part Number Description Manufacturer Compare
GS8662D09BD-300T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662D09BD-300T
CY7C1527V18-250BZI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1527V18-250BZI
CY7C1527AV18-167BZXC DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1527AV18-167BZXC
CY7C1577KV18-500BZI DDR SRAM, 8MX9, 0.33ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1577KV18-500BZI
CY7C1526V18-167BZI QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1526V18-167BZI
GS8662D10BGD-300 DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662D10BGD-300
GS8662Q10BD-300T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662Q10BD-300T
GS8662DT11BD-450IT QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q10BD-357I vs GS8662DT11BD-450IT
CY7C1557V18-300BZXC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1557V18-300BZXC
CY7C1576KV18-400BZXC QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.4 MM HEIGHT, FBGA-165 Cypress Semiconductor GS8662Q10BD-357I vs CY7C1576KV18-400BZXC

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