Part Details for GS8662Q09BGD-300I by GSI Technology
Overview of GS8662Q09BGD-300I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LT8300IS5#TRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LT8300IS5#WTRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LTC3300IUK-2#TRPBF | Analog Devices | Addressable Hi Eff Bi-dir Mult |
Price & Stock for GS8662Q09BGD-300I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662Q09BGD-300I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS8662Q09BGD-300I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$76.7016 / $94.4460 | Buy Now |
DISTI #
464-GS8662Q09BGD300I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 9 72M RoHS: Compliant | 0 |
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$85.9000 / $89.7200 | Order Now |
Part Details for GS8662Q09BGD-300I
GS8662Q09BGD-300I CAD Models
GS8662Q09BGD-300I Part Data Attributes
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GS8662Q09BGD-300I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662Q09BGD-300I
GSI Technology
QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, BGA165,11X15,40 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.86 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662Q09BGD-300I
This table gives cross-reference parts and alternative options found for GS8662Q09BGD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q09BGD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS8662Q09BD-300I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662Q09BGD-300I vs GS8662Q09BD-300I |