There are no models available for this part yet.
Overview of GS8662DT37BGD-350 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for GS8662DT37BGD-350 by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS8662DT37BGD-350
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662DT37BGD-350) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$75.3348 / $92.7630 | Buy Now | |
|
DISTI #
464-GS8662DT37BGD350
|
Mouser Electronics | SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant | 0 |
|
$73.8600 / $88.1200 | Order Now |
CAD Models for GS8662DT37BGD-350 by GSI Technology
Part Data Attributes for GS8662DT37BGD-350 by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA,
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.B
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
24 Weeks
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
Length
|
15 mm
|
|
Memory Density
|
75497472 bit
|
|
Memory IC Type
|
QDR SRAM
|
|
Memory Width
|
36
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
2097152 words
|
|
Number of Words Code
|
2000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
2MX36
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Seated Height-Max
|
1.4 mm
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
13 mm
|
Alternate Parts for GS8662DT37BGD-350
This table gives cross-reference parts and alternative options found for GS8662DT37BGD-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662DT37BGD-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61QDB42M36A-333B4L | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61QDB42M36A-333B4L |
| IS61QDP2B22M36A-300M3 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61QDP2B22M36A-300M3 |
| GS8662T38BGD-400T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT37BGD-350 vs GS8662T38BGD-400T |
| IS61QDP2B22M36A-300M3L | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61QDP2B22M36A-300M3L |
| IS61DDB42M36A-300B4 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61DDB42M36A-300B4 |
| GS8662Q37BD-300T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT37BGD-350 vs GS8662Q37BD-300T |
| GS8662T38BD-500 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT37BGD-350 vs GS8662T38BD-500 |
| IS61DDP2B22M36A-400B4L | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61DDP2B22M36A-400B4L |
| GS8662T38BGD-500I | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT37BGD-350 vs GS8662T38BGD-500I |
| IS61DDPB42M36A-550M3 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT37BGD-350 vs IS61DDPB42M36A-550M3 |