Part Details for GS84032AB-100I by GSI Technology
Overview of GS84032AB-100I by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HIP2100IB | Renesas Electronics Corporation | 100V/2A Peak High-Frequency Half Bridge Driver with CMOS Logic Inputs, SOICN, /Tube | |
| HFA1100IBZ96 | Renesas Electronics Corporation | 850MHz, Low Distortion Current Feedback Operational Amplifiers, SOICN, /Reel | |
| HIP2100IRZ | Renesas Electronics Corporation | 100V/2A Peak High-Frequency Half Bridge Driver with CMOS Logic Inputs |
Part Details for GS84032AB-100I
GS84032AB-100I CAD Models
GS84032AB-100I Part Data Attributes
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GS84032AB-100I
GSI Technology
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Datasheet
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GS84032AB-100I
GSI Technology
Cache SRAM, 128KX32, 12ns, CMOS, PBGA119, FPBGA-119
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA153,9X17,50 | |
| Pin Count | 119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 12 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e0 | |
| Length | 22 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 32 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA153,9X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.19 mm | |
| Standby Current-Max | 0.03 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.2 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS84032AB-100I
This table gives cross-reference parts and alternative options found for GS84032AB-100I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS84032AB-100I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| GS84032AB-100T | GSI Technology | Check for Price | Cache SRAM, 128KX32, 12ns, CMOS, PBGA119, FPBGA-119 | GS84032AB-100I vs GS84032AB-100T |