There are no models available for this part yet.
Overview of GS8342S18BD-250I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
MSP430FG4250IRGZR | Texas Instruments | 16-Bit Ultra-Low-Power MCU, 16kB Flash, 256B RAM, 16-bit Sigma-Delta A/D, 12-bit D/A, 2 OPAMP, LCD 48-VQFN -40 to 85 |
Price & Stock for GS8342S18BD-250I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS8342S18BD-250I
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342S18BD-250I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$34.2504 / $42.1740 | Buy Now | |
DISTI #
464-GS8342S18BD-250I
|
Mouser Electronics | SRAM 1.8 or 1.5V 2M x 18 36M | 0 |
|
$36.3000 / $45.2000 | Order Now |
CAD Models for GS8342S18BD-250I by GSI Technology
Part Data Attributes for GS8342S18BD-250I by GSI Technology
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA, BGA165,11X15,40
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
24 Weeks
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
250 MHz
|
I/O Type
|
SEPARATE
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e0
|
Length
|
15 mm
|
Memory Density
|
37748736 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
2MX18
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Current-Max
|
0.195 A
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
0.47 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
13 mm
|