Datasheets
GS8342DT37BGD-400I by: GSI Technology

QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8342DT37BGD-400I by GSI Technology

Overview of GS8342DT37BGD-400I by GSI Technology

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

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Price & Stock for GS8342DT37BGD-400I

Part # Distributor Description Stock Price Buy
DISTI # 2364-GS8342DT37BGD-400I-ND
DigiKey IC SRAM 36MBIT PARALLEL 165FPBGA Min Qty: 15 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 15 $62.0000
$62.0000 Buy Now
DISTI # GS8342DT37BGD-400I
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342DT37BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $65.0430
  • 288 $63.8604
  • 576 $60.7068
  • 864 $59.1300
  • 1,152 $57.1590
$57.1590 / $65.0430 Buy Now
DISTI # 464-8342DT37BGD400I
Mouser Electronics SRAM 1.8 or 1.5V 1M x 36 36M RoHS: Compliant 0
  • 15 $61.7900
  • 30 $61.0300
  • 60 $60.3300
  • 105 $56.2300
$56.2300 / $61.7900 Order Now

Part Details for GS8342DT37BGD-400I

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GS8342DT37BGD-400I Part Data Attributes

GS8342DT37BGD-400I GSI Technology
Buy Now Datasheet
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GS8342DT37BGD-400I GSI Technology QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8342DT37BGD-400I

This table gives cross-reference parts and alternative options found for GS8342DT37BGD-400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8342DT37BGD-400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8342DT38BD-400I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BD-400I
GS8342DT38BD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BD-400IT
GS8342DT37BD-400I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT37BD-400I
GS8342DT38BGD-400I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BGD-400I
GS8342DT38BGD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BGD-400IT
GS8342DT37BD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT37BD-400IT
GS8342DT37BGD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT37BGD-400IT
Part Number Description Manufacturer Compare
GS8342DT38BD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BD-400IT
GS8342DT37BGD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT37BGD-400IT
GS8342DT37BD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT37BD-400IT
GS8342DT38BD-400I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BD-400I
GS8342DT38BGD-400IT QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BGD-400IT
GS8342DT38BGD-400I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8342DT37BGD-400I vs GS8342DT38BGD-400I

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