Datasheets
GS8342DT37BGD-333I by: GSI Technology

QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8342DT37BGD-333I by GSI Technology

Overview of GS8342DT37BGD-333I by GSI Technology

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Price & Stock for GS8342DT37BGD-333I

Part # Distributor Description Stock Price Buy
DISTI # GS8342DT37BGD-333I
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8342DT37BGD-333I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $53.2620
  • 288 $52.2936
  • 576 $49.7112
  • 864 $48.4200
  • 1,152 $46.8060
$46.8060 / $53.2620 Buy Now
DISTI # 464-8342DT37BGD333I
Mouser Electronics SRAM 1.8 or 1.5V 1M x 36 36M RoHS: Compliant 0
  • 1 $57.0900
  • 10 $52.9500
  • 30 $51.0500
  • 60 $49.7800
  • 105 $43.6200
$43.6200 / $57.0900 Order Now

Part Details for GS8342DT37BGD-333I

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GS8342DT37BGD-333I Part Data Attributes

GS8342DT37BGD-333I GSI Technology
Buy Now Datasheet
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GS8342DT37BGD-333I GSI Technology QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8342DT37BGD-333I

This table gives cross-reference parts and alternative options found for GS8342DT37BGD-333I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8342DT37BGD-333I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
GS8342DT37BD-333I GSI Technology Check for Price QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GS8342DT37BGD-333I vs GS8342DT37BD-333I
Part Number Manufacturer Composite Price Description Compare
GS8342DT37BGD-333IT GSI Technology Check for Price QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GS8342DT37BGD-333I vs GS8342DT37BGD-333IT
GS8342DT37BD-333IT GSI Technology Check for Price QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GS8342DT37BGD-333I vs GS8342DT37BD-333IT

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